![footer_logo(1).png](https://static.wixstatic.com/media/9d8bfd_a80d48a3ec064f9c8d573aaa84ed4b70~mv2.png/v1/fill/w_162,h_50,al_c,q_85,usm_0.66_1.00_0.01,enc_avif,quality_auto/footer_logo(1).png)
先进固态半导体实验室
Advanced Solid-state Semiconductor Lab
Prof.Wei Kong
Department of material science and engineering,
Westlake University, Hangzhou, China
Email:kongwei@westlake.edu.cn
Postdoctoral Fellow
Junshuai Li
Chinese Academy of Science
-
Wide bandgap semiconductor power device
-
Compound semiconductor epitaxy;
-
Nanowire growth
Huaze Zhu
University Of Science And Technology Of China
-
Transmission Electron Microscopy
-
New low-dimensional heterojunction
Graduate Students
Jichuang Shen
LanZhou University
-
High quality 2D materials synthesis and devices farbrication.
Wenhao Li
Central South University
-
2D materials and device
![微信图片_20210823114014.jpg](https://static.wixstatic.com/media/9d8bfd_b448d422cade4bf0981428b4856d8309~mv2.jpg/v1/crop/x_0,y_136,w_2112,h_2494/fill/w_299,h_354,al_c,q_80,usm_0.66_1.00_0.01,enc_avif,quality_auto/%E5%BE%AE%E4%BF%A1%E5%9B%BE%E7%89%87_20210823114014.jpg)
Tong Jiang
Qingdao University
-
Wide-bandgap semiconductor materials.
-
Power devices and photodetectors.
Research Assistants
Administrative Assistants
Qiyu Xing
University of California,Los Angeles
-
Large area 2D material synthesis
Laixiang Qin
Peking University
-
Novel two dimensional device for beyond Moore period
Haoxiang Duan
Nankai University
-
2D materials and device
Jun Yang
University of Science and Technology of China
-
3D heterogeneous structure stacking process to explore new interface physical phenomena including electrical, optical, etc.
![微信图片_20210823120913.jpg](https://static.wixstatic.com/media/9d8bfd_e4b472333c0a40608f720e746a9e1ce4~mv2.jpg/v1/crop/x_0,y_248,w_2880,h_3344/fill/w_210,h_244,al_c,q_80,usm_0.66_1.00_0.01,enc_avif,quality_auto/%E5%BE%AE%E4%BF%A1%E5%9B%BE%E7%89%87_20210823120913.jpg)
![微信图片_20210709102021.jpg](https://static.wixstatic.com/media/9d8bfd_a4a0ce3031554b67a17ccff51e03bd4b~mv2.jpg/v1/crop/x_453,y_205,w_648,h_779/fill/w_203,h_244,al_c,q_80,usm_0.66_1.00_0.01,enc_avif,quality_auto/%E5%BE%AE%E4%BF%A1%E5%9B%BE%E7%89%87_20210709102021.jpg)
![3757e70b4cd32313d1f1fe8e25de0fc.jpg](https://static.wixstatic.com/media/9d8bfd_68616bd46e7d40cd94152606f98c5dac~mv2.jpg/v1/crop/x_336,y_223,w_615,h_708/fill/w_212,h_244,al_c,q_80,usm_0.66_1.00_0.01,enc_avif,quality_auto/3757e70b4cd32313d1f1fe8e25de0fc.jpg)
Tingyu Zhu
King's College London
-
Physics
Haojie Zhu
Zhejiang University
-
Electronic and information engineering
Yifei Wang
Beihang University
-
Material science and engineering
![bd48335d842ffcc0f099c1b0461ac5c.jpg](https://static.wixstatic.com/media/9d8bfd_04ff837cadde47528c736175f4c8ae10~mv2.jpg/v1/crop/x_297,y_0,w_1109,h_1276/fill/w_212,h_244,al_c,q_80,usm_0.66_1.00_0.01,enc_avif,quality_auto/bd48335d842ffcc0f099c1b0461ac5c.jpg)
Runze Liu
Sichuan University
-
Organic wafer bonding
-
Wearable system
Xiang Xu
The University of Melbourne
-
Flexible electronic material components
-
Wide bandgap semiconductor materials
Han Chen
Harbin Engineering University
-
First-principles calculations
Yaqing Ma
Harbin Institute of Technology
-
Ga2O3 high-speed epitaxy based on HVPE
-
Large-area GaN templates beyond wafer-scale